A comparative study on Sn macrosegregation behavior of ternary Al-Sn-Cu alloys prepared by gravity casting and squeeze casting

Macrosegregation in direct-chill casting of aluminium alloys

Thermodynamic Study of Al-Ge-Sn Ternary Alloys by E.M.F. Measurements

für Naturforschung in cooperation with the Max Planck Society for the Advancement of Science under a Creative Commons Attribution 4.0 International License. Dieses Werk wurde im Jahr 2013 vom Verlag Zeitschrift für Naturforschung in Zusammenarbeit mit der Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. digitalisiert und unter folgender Lizenz veröffentlicht: Creative Commons Namen...

PRECIPITATION STRENGTHENING BEHAVIOR OF Al-Cu-Mn ALLOYS WITH THE EFFECT OF CASTING SEGREGATION

Al-Cu-Mn is one of typical heat-treatable cast alloys with high strength which has been widely used in aerospace and automobile industries. The complete manufacturing process for AlCu-Mn components includes low pressure die casting, T6 heat treatment and machining. It has been found that the property in former process has been transferred to the sequent step with considerable effect. In this pa...

A TRANSIENT TWO-DIMENTIONAL INVERSE ESTIMATION OF THE METAL-MOLD HEAT TRANSFER COEFFICIENT DURING SQUEEZE CASTING of AL-4.5WT%CU

In this paper, a transient, two-dimensional and nonlinear inverse heat conduction problem in solidification process is considered. Genetic algorithm is applied for the identification of the interfacial heat transfer coefficients during squeeze casting of commercial aluminum alloy (Al-4.5wt%Cu) by assuming a priori information regarding the functional form of the unknown heat transfer coefficien...

The Kinetics of Formation of Ternary Intermetallic Alloys in Pb-Sn and Cu-Ag-Sn Pb-free Electronic Joints

A simple model of the formation of Au0.1Ni0.1Sn0.8 in Pb-Sn solder/Ni interconnects is examined by numerical simulation. Previous experimental observation has shown that after reflow the interface consists of the Ni3Sn4 alloy between Pb-Sn solder and Ni, with Au distributed through the PbSn solder ball. Au0.1Ni0.1Sn0.8 was observed to form at the Pb-Sn solder/Ni3Sn4 interface during annealing a...